ISO/IEC-14575 Heterogeneous InterConnect (HIC) (low cost, low latency, scalable, serial interconnect for parallel system construction)

ISO/IEC-14575 - 1ST EDITION - CURRENT


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This International Standard applies to physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10 Mbit/s to 200 Mbit/s and at 1 Gbit/s in copper and optic technologies (as developed in Open Microprocessor Systems Initiative/Heterogeneous InterConnect Project (OMI/HIC)).

The object of this International Standard is to enable high-performance, scalable, modular, parallel systems to be constructed with low system integration cost; to support communications systems fabric; to provide a transparent implementation of a range of high-level protocols (communications, e.g. ATM, message passing, shared memory transactions, etc.), and to support links between heterogeneous systems.

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Document Number

ISO/IEC 14575:2000

Revision Level

1ST EDITION

Status

Current

Publication Date

July 1, 2000

Committee Number

ISO/IEC JTC 1/SC 26