MIL-I-24092/8 Complete Document History
Insulating Resin, Solventless, Thixotropic, Baking, Semi-Rigid, for Dip Processing, Grade Sht, Class 155 To 200 Thermal Class

Complete Current Edition:
   REVISION A - INSULATING RESIN, SOLVENTLESS, - Sept. 21, 1993

Obsolete Revision Information:
   BASE - INSULATING RESIN, SOLVENTLESS, - May 4, 1989