MIL-S-13949/19 Sheet, Printed Wiring Board, Laminated, Base Material Qi (Woven Quartz Reinforcement, Polyimide Resin, Heat Resistant, Metal Clad or Unclad) (No Superseding Document)

MIL-S-13949/19 - REV A CANCELLATION 2 - CANCELLED
Show Complete Document History


Sheet, Printed Wiring Board, Laminated, Base Material Qi (Woven Quartz Reinforcement, Polyimide Resin, Heat Resistant, Metal Clad or Unclad) (No Superseding Document)


To find similar documents by Federal Supply Class Code:

FSC 5998 (Electrical and Electronic assemblies, Boards, Cards, and Associated Hardware)

 

Customers who bought this document also bought:

IPC-A-600
Acceptability of Printed Boards

ISO-9000 COMPENDIUM
ISO 9000 - Quality Management (12th Edition Compendium)

MIL-PRF-38535
Integrated Circuits (Microcircuits) Manufacturing, General Specification for

ORDER



Document Number

MIL-S-13949/19

Revision Level

REV A CANCELLATION 2

Status

Cancelled

Publication Date

Nov. 30, 1998

Page Count

1 page