MIL-S-13949/2 › Sheet, Printed Wiring Board, Laminated, Base Material Gb (Woven E-Glass Reinforcement, Majority Polyfunctional Epoxy Resin, Hot Strength Retention, Metal Clad or Unclad) (No Superseding Document)

MIL-S-13949/2 - REV C CANCELLATION 1 - CANCELLED
Show Complete Document History


Sheet, Printed Wiring Board, Laminated, Base Material Gb (Woven E-Glass Reinforcement, Majority Polyfunctional Epoxy Resin, Hot Strength Retention, Metal Clad or Unclad) (No Superseding Document)


To find similar documents by Federal Supply Class Code:

FSC 5998 (Electrical and Electronic assemblies, Boards, Cards, and Associated Hardware)

 

Customers who bought this document also bought:

MIL-PRF-38535
Integrated Circuits (Microcircuits) Manufacturing, General Specification for

QPL-55110
Printed Wiring Board, Rigid, General Specification for

MIL-S-13949
Sheet, Printed Wiring Board, General Specification for (No Superseding Document)

ORDER



Document Number

MIL-S-13949/2

Revision Level

REV C CANCELLATION 1

Status

Cancelled

Publication Date

July 30, 1999

Page Count

1 page