MIL-STD-883 › Microcircuits
This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices. The test methods, controls, and procedures described herein have been prepared to serve several purposes:
a. To specify suitable conditions obtainable in the laboratory and at the device level which give test results equivalent to the actual service conditions existing in the field, and to obtain reproducibility of the results of tests. The tests described herein are not to be interpreted as an exact and conclusive representation of actual service operation in any one geographic or outer space location, since it is known that the only true test for operation in a specific application and location is an actual service test under the same conditions.
b. To describe in one standard all of the test methods of a similar character which now appear in the various joint-services and NASA microelectronic device specifications, so that these methods may be kept uniform and thus result in conservation of equipment, manhours, and testing facilities. In achieving this objective, it is necessary to make each of the general tests adaptable to a broad range of devices.
c. To provide for a level of uniformity of physical, electrical and environmental testing; manufacturing controls and workmanship; and materials to ensure consistent quality and reliability among all devices screened in accordance with this standard.
1.2 Intended use of or reference to MIL-STD-883.
When this document is referenced or used in conjunction with the processing and testing of JAN devices in conformance with the requirements of appendix A of MIL-PRF-38535, QML devices in conformance with MIL-PRF-38535 or non-JAN devices in accordance with 1.2.1 or 1.2.2 herein, such processing and testing is required to be in full conformance with all the applicable general requirements and those of the specifically referenced test methods and procedures.
For contracts negotiated prior to 31 December 1984, device types that have been classified as manufacturer's 883 (B or S) product prior to 31 December 1984 are not required to meet 1.2.1 or 1.2.2.
Existing contracts as of the 31 December 1984, previously negotiated add-ons to these contracts, and future spares for these contracts may continue to use device types which were classified as manufacturer's 883 (B or S) prior to 31 December 1984.
New contracts, and any device types classified as compliant to MIL-STD-883 after 31 December 1984 are required to comply with 1.2.1. Any devices meeting only the provisions of 1.2.2 are noncompliant to MIL-STD-883.
The intended use of this standard is to establish appropriate conditions for testing microcircuit devices to give test results that simulate the actual service conditions existing in the field. This standard has been prepared to provide uniform methods, controls, and procedures for determining with predictability the suitability of such devices within Military, Aerospace and special application equipment. This standard is applicable only to microelectronic devices, i.e. monolithic, multi-chip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed.
Chemicals that are used in the MIL-STD-883 test methods include:
Propylene Glycol Monomethyl Ether
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Sept. 16, 2019