NAS-4123 › Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (Dip)
Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (Dip)
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Document Number
NAS-4123
Revision Level
REVISION 2
Status
Current
Publication Date
Jan. 31, 2024
Page Count
16 pages