PD-IEC-62866 › Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
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Patterns;Electrical resistance;Dimensions;Holes;Electronic equipment and components;Voltage;Coated materials;Layout;Angles (geometry);Printed-circuit boards;Fire safety;Protective coatings;Heat loss;Thickness;Position;Packaging materials;Electric conductors;Electrical insulation;Printed wiring;Finishes;Electric contacts;Packaging;Adhesive strength;Metal coatings;Printed circuits;Assembling;Flammability;Printed-circuit bases;Design;Electric current;Electrical connections
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PD IEC/TR 62866:2014
May 7, 2014
IEC TR 62866:2014