PD-IEC-62866 › Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
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Patterns,Electrical resistance,Dimensions,Holes,Electronic equipment and components,Voltage,Coated materials,Layout,Angles (geometry),Printed-circuit boards,Fire safety,Protective coatings,Heat loss,Thickness,Position,Packaging materials,Electric conductors,Electrical insulation,Printed wiring,Finishes,Electric contacts,Packaging,Adhesive strength,Metal coatings,Printed circuits,Assembling,Flammability,Printed-circuit bases,Design,Electric current,Electrical connections
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PD IEC/TR 62866:2014
May 7, 2014
IEC TR 62866:2014