PD-IEC-62866 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

PD-IEC-62866 - 2014 EDITION - CURRENT


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Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

Keywords

Patterns,Electrical resistance,Dimensions,Holes,Electronic equipment and components,Voltage,Coated materials,Layout,Angles (geometry),Printed-circuit boards,Fire safety,Protective coatings,Heat loss,Thickness,Position,Packaging materials,Electric conductors,Electrical insulation,Printed wiring,Finishes,Electric contacts,Packaging,Adhesive strength,Metal coatings,Printed circuits,Assembling,Flammability,Printed-circuit bases,Design,Electric current,Electrical connections

To find similar documents by classification:

31.180 (Printed circuits and boards)

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Document Number

PD IEC/TR 62866:2014

Revision Level

2014 EDITION

Status

Current

Publication Date

May 7, 2014

Page Count

96

ISBN

9780580833397

International Equivalent

IEC TR 62866:2014

Committee Number

EPL/501