PD-IEC-62866 › Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
PD-IEC-62866
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2014 EDITION
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CURRENT
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Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Keywords
Patterns;Electrical resistance;Dimensions;Holes;Electronic equipment and components;Voltage;Coated materials;Layout;Angles (geometry);Printed-circuit boards;Fire safety;Protective coatings;Heat loss;Thickness;Position;Packaging materials;Electric conductors;Electrical insulation;Printed wiring;Finishes;Electric contacts;Packaging;Adhesive strength;Metal coatings;Printed circuits;Assembling;Flammability;Printed-circuit bases;Design;Electric current;Electrical connections
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31.180 (Printed circuits and boards)
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Document Number
PD IEC/TR 62866:2014
Revision Level
2014 EDITION
Status
Current
Publication Date
May 7, 2014
Page Count
96
ISBN
9780580833397
International Equivalent
IEC TR 62866:2014
Committee Number
EPL/501