SS-EN-ISO-9455-14 Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)

SS-EN-ISO-9455-14 - 2018 EDITION - CURRENT


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ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

To find similar documents by classification:

25.160.50 (Brazing and soldering Including brazing and soldering alloys and equipment)

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Designation Name

SS-EN ISO 9455-14:2018

Revision Level

2018 EDITION

Status

Current

Publication Date

Jan. 8, 2018

Language(s)

English

Page Count

20

International Equivalent

EN ISO 9455-14:2017(IDT); ISO 9455-14:2017(IDT)