SS-EN-ISO-9455-17 Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)

SS-EN-ISO-9455-17 - 2006 EDITION - CURRENT


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This part of ISO 9455 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders (ISO 9453:1990, Class E). NOTE This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

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25.160.50 (Brazing and soldering Including brazing and soldering alloys and equipment)

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Designation Name

SS-EN ISO 9455-17:2006

Revision Level

2006 EDITION

Status

Current

Publication Date

July 3, 2006

Language(s)

English

Page Count

25