ASTM-F638 › Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding
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Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding
Scope
1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.
1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.
Keywords
magnesium aluminum wire; wire bonding
To find similar documents by ASTM Volume:
10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)
To find similar documents by classification:
29.060.10 (Wires Including electric rods, busbars, etc.)
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Document Number
ASTM-F638-88(1995)e1
Revision Level
1988 R95(E1) EDITION
Status
Superseded
Modification Type
Reapproval with Ed Change
Publication Date
June 1, 1995
Document Type
Specification
Page Count
3 pages
Committee Number
F01.07