ASTM-F72 Historical Revision Information
Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2015)

ASTM-F72 - 1985 EDITION - SUPERSEDED
Show Complete Document History

Document Center Inc. is an authorized dealer of ASTM standards.
The following bibliographic material is provided to assist you with your purchasing decision:

Standard Specification for Gold Wire for Semiconductor Lead Bonding
ORDER

Scope

1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, ( 3) high-strength wire, and (4) special purpose wire.

Note 1--Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties or both. This practice is known variously as "modifying,"" stabilizing," or "doping." The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, "high-strength" and "special purpose" wire, the identity of modifying additives is not restricted.

1.2 The values stated in SI units shall be regarded as the standard.

1.2.1 A mixed system of metric and inch-pound units is in widespread use for specifying semiconductor lead-bonding wire. SI-equivalent values of other commonly used units are denoted by parentheses in text and tables.

1.3 The following hazard caveat pertains only to the test method portion, Section 9, of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Keywords

gold wire; semiconductor; internal; electrical connections; copper-modified wire; beryllium-modified wire; high-strength wire; special purpose wire; lead bonding; thermal stability; high purity gold wire

To find similar documents by ASTM Volume:

10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)

To find similar documents by classification:

29.060.10 (Wires Including electric rods, busbars, etc.)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

Document Number

ASTM-F72-85

Revision Level

1985 EDITION

Status

Superseded

Modification Type

Revision

Publication Date

Jan. 1, 1985

Document Type

Specification

Page Count

15 pages

Committee Number

F01.07