EN-62137-4 › Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

EN-62137-4 - 2014 EDITION - CURRENT -- See the following: BS-EN-62137-4 DIN-EN-62137-4



Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices


To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

ORDER



Document Number

EN 62137-4:2014

Revision Level

2014 EDITION

Status

Current

Publication Date

Dec. 12, 2014