IEC-63251 › Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

IEC-63251 - EDITION 1.0 - CURRENT


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IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
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31.180 (Printed circuits and boards)

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Document Number

IEC 63251 Ed. 1.0 b:2023

Revision Level

EDITION 1.0

Status

Current

Publication Date

Nov. 1, 2023

Committee Number

91