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Scope

1.1 This test method covers a procedure for measuring the compressive residual strain in thin films. It applies only to films, such as found in microelectromechanical systems (MEMS) materials, which can be imaged using an interferometer. Measurements from fixed-fixed beams that are touching the underlying layer are not accepted.

1.2 This test method uses a non-contact optical interferometer with the capability of obtaining topographical 3-D data sets. It is performed in the laboratory.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Significance and Use

Residual strain measurements are an aid in the design and fabrication of MEMS devices. The value for residual strain is used in Young’modulus calculations.

Keywords

cantilevers; combined standard uncertainty; fixed-fixed beams; interferometry; length measurements; microelectromechanical systems; MEMS; polysilicon; residual strain; stiction; strain gradient; test structure; ICS Number Code 37.040.20 (Photographic paper, film and plates. Cartridges)

To find similar documents by ASTM Volume:

03.01 (Metals -- Mechanical Testing; Elevated and Low-Temperature Tests; Metallography)

To find similar documents by classification:

37.040.20 (Photographic paper, films and plates. Cartridges)

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