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Scope

1.1 This test method covers a procedure for measuring the strain gradient in thin, reflecting films. It applies only to films, such as found in microelectromechanical systems (MEMS) materials, which can be imaged using an optical interferometer, also called an interferometric microscope. Measurements from cantilevers that are touching the underlying layer are not accepted.

1.2 This test method uses a non-contact optical interferometric microscope with the capability of obtaining topographical 3-D data sets. It is performed in the laboratory.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Significance and Use

Strain gradient values are an aid in the design and fabrication of MEMS devices.

Keywords

cantilevers; combined standard uncertainty; fixed-fixed beams; interferometry; length measurements; microelectromechanical systems; MEMS; polysilicon; residual strain; round robin; stiction; strain gradient; test structure; Alignment; Calibration--metals/alloys analysis instrumentation; Cantilever testing; Combined standard uncertainty; Fixed-fixed beams; Interferograms/Interferometry; Length; Microelectromechanical systems (MEMS); Noncontacting optical strain measurement systems; Polysilicon materials/applications; Residual strains; Stiction; Strain gradient; Thin film applications; ICS Number Code 37.040.20 (Photographic paper, film and plates. Cartridges)

To find similar documents by ASTM Volume:

03.01 (Metals -- Mechanical Testing; Elevated and Low-Temperature Tests; Metallography)

To find similar documents by classification:

37.040.20 (Photographic paper, films and plates. Cartridges)

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