ASTM-F3166 › Complete Document History
Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023)


Obsolete Revision Information:
   WITHDRAWN - WITHDRAWN WITHOUT SUPERCEDING - Nov. 29, 2023
   2016 EDITION - High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization - July 15, 2016