BS-4584-103.1 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board | Document Center, Inc.

BS-4584-103.1 › Complete Document History
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board

Obsolete Revision Information:

1990 EDITION - WITHDRAWN, 4/24/2012 - Feb. 28, 1990