BS-EN-61189-2 › Historical Revision Information
Part 2: Test Methods for Materials for Interconnection Structures

BS-EN-61189-2 - 1997 EDITION AMENDMENT 2 - SUPERSEDED
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies

Keywords

Blistering;Precision;Electrical testing;Compressible flow;Pull-out tests;Time;Electrical insulating materials;High-temperature testing;Electronic equipment and components;Printed circuits;Electrodes;Testing conditions;Test specimens;Chemical analysis and testing;Volatile matter determination;Determination of content;Electric arcs;Gelation;Thermal testing;Electrical resistivity;Chemical-resistance tests;Flow measurement;Position;Cleaning;Sodium hydroxide;Resistance measurement;Accuracy;Thermal-shock tests;Impregnated materials;Plastics;Printed-circuit boards;Test equipment;Peeling tests

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31.180 (Printed circuits and boards)

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Document Number

BS-EN-61189-2

Revision Level

1997 EDITION AMENDMENT 2

Status

Superseded

Publication Date

March 1, 2001

International Equivalent

IEC 61189-2:2006;EN 61189-2:2006;EN 60068-2-21 (IEC 60068-2-21:1999 AS)

Committee Number

EPL/501