BS-EN-62047-9 › Semiconductor devices. Micro-electromechanical devices
BS-EN-62047-9
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2011 EDITION
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CURRENT
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Included in this current edition are the following subparts:
2011 EDITION - Sept. 30, 2011
2011 EDITION CORRIGENDUM 1 - Jan. 1, 2013
2011 EDITION CORRIGENDUM 1 - Jan. 1, 2013
Keywords
Semiconductor devices;Bonding;Tensile testing;Substrates (insulating);Electrostatics;Electronic equipment and components;Electromechanical devices;Bend testing;Shear testing;Visual inspection (testing);Adhesive strength;Integrated circuits;Semiconductor technology;Adhesion tests
To find similar documents by classification:
31.080.99 (Other semiconductor devices)
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Document Number
BS EN 62047-9:2011
Revision Level
2011 EDITION
Status
Current
Publication Date
Jan. 31, 2013
Page Count
30
ISBN
9780580787935
International Equivalent
IEC 62047-9:2011/COR1:2012
Committee Number
EPL/47