DIN-EN-60191-6-17 › Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011);

DIN-EN-60191-6-17 - 2011 EDITION - CURRENT



Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011);


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Document Number

DIN-EN-60191-6-17

Revision Level

2011 EDITION

Status

Current

Publication Date

Sept. 1, 2011