DIN-EN-61189-5-4 › Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC

DIN-EN-61189-5-4 - 2015 EDITION - CURRENT



Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC


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Document Number

DIN EN 61189-5-4:2015-11

Revision Level

2015 EDITION

Status

Current

Publication Date

Nov. 1, 2015