IEC-60068-2-69 › Complete Document History
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Complete Current Edition:
   EDITION 3.1 - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method - June 1, 2019
   FOR ED. 3.0 AMENDMENT 1 SEE - IEC-60068-2-69-AM1 - June 1, 2019

Obsolete Revision Information:
   ED. 3.0 CORRIGENDUM 1 - CORRIGENDUM 1 FOR EDITION 3.0 - Jan. 1, 2018
   EDITION 3.0 - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method - March 7, 2017
   2ND EDITION - Part 2-69: Tests - Test Te/Tc: Solderability testing of elec - May 1, 2007