IEC-60191-6-12 Complete Document History
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

Complete Current Edition:
   EDITION 2.0 - SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-P - June 1, 2011

Obsolete Revision Information:
   1ST EDITION - SEMICONDUCTOR DEVICE PACKAGES - June 1, 2002