IEC-60749-20 › Complete Document History
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Complete Current Edition:
   EDITION 3.0 - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Aug. 1, 2020

Obsolete Revision Information:
   EDITION 2.0 - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Dec. 1, 2008
   ED. 1.0 CORRIGENDUM 1 - CORRIGENDUM 1 FOR EDITION 1.0 - Aug. 1, 2003
   EDITION 1.0 - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Sept. 1, 2002