IEC-61188-5-4 › Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
IEC-61188-5-4
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EDITION 1.0
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CURRENT
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IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with ""J"" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
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31.180 (Printed circuits and boards)
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Document Number
IEC 61188-5-4 Ed. 1.0 b:2007
Revision Level
EDITION 1.0
Status
Current
Publication Date
Oct. 1, 2007
Committee Number
91