IEC-61189-5-4 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

IEC-61189-5-4 - EDITION 1.0 - CURRENT


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IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.
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Document Number

IEC 61189-5-4 Ed. 1.0 b:2015

Revision Level

EDITION 1.0

Status

Current

Publication Date

Jan. 8, 2015

Committee Number

91