IEC-61190-1-3 › Complete Document History
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Complete Current Edition:
   EDITION 3.0 - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications - Dec. 1, 2017

Obsolete Revision Information:
   EDITION 2.1 - CONSOLIDATES AMENDMENT 1 - Nov. 1, 2010
   FOR AMENDMENT 1 SEE - IEC-61190-1-3-AM1 - June 1, 2010
   2ND EDITION - SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS, ATTACHMENTS M - April 1, 2007
   1ST EDITION - SOLDERS FOR ELECTRONIC SOLDERI - March 1, 2002