IEC-62878-2-7 › Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

IEC-62878-2-7 - EDITION 1.0 - CURRENT


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IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
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31.180 (Printed circuits and boards)

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Document Number

IEC/TR 62878-2-7 Ed. 1.0 en:2019

Revision Level

EDITION 1.0

Status

Current

Publication Date

March 1, 2019

Committee Number

91