IPC/EIA-J-STD-006 › Historical Revision Information
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Abstract
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for "special'' electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.
Notes
Claudia's Notes:
If you're doing soldering in the electronics industry, you'll also want to review IPC/EIA-J-STD-005, Requirements for Soldering Fluxes, and IPC/EIA-J-STD-006, Requirements for Soldering Pastes.
If there's issues with marking for lead-free materials and assemblies, see IPC/JEDEC-J-STD-609, Lead- Free and Leaded Marking, Symbols and Labels.
This document comes with our free Notification Service, good for the life of the document.
This document is available in Paper format.
Document Number
IPC/EIA-J-STD-006
Revision Level
REV B AMENDMENT 1
Status
Superseded
Publication Date
June 1, 2008
Page Count
4 pages