MIL-A-45059 › Adhesive for Bonding Chipboard To Terneplate, Tinplate, and Zincplate (No Superseding Document)
Adhesive for Bonding Chipboard To Terneplate, Tinplate, and Zincplate (No Superseding Document)
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Document Number
MIL-A-45059
Revision Level
REV C CANCELLATION 2
Status
Cancelled
Publication Date
June 4, 1996
Page Count
1 page