MIL-PRF-31032/5 › Complete Document History
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
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REVISION C/AM 2 - REVISION C WITH AMENDMENT 2 INTERFILED - Sept. 15, 2022
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Obsolete Revision Information: |
REVISION C/AM 1 - REVISION C WITH AMENDMENT 1 INTERFILED - June 10, 2021
REVISION C - Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications - May 5, 2020
REVISION B - Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications - Oct. 5, 2017
REVISION A - Thermoplastic and Thermosetting Resin Base Material, with Pl - Dec. 9, 2012
BASE/AM 2 - BASE/AMENDMENT 2 INTERFILED - Jan. 31, 2011
BASE/AM 1 - BASE/AMENDMENT 1 INTERFILED - March 10, 2009
BASE - THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES - Aug. 20, 2007
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