Document Center is acquired by Nimonik

Scope

1 Scope

1.1 These requirements apply to rigid printed-wiring boards and flexible printed-wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.

1.2 The flexible printed-wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections.

1.3 These requirements do not cover flexible printed-wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections.

1.4 These requirements do not apply to flexible, flex-to-install, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances - that are covered by the Standard for Flexible Materials Interconnect Constructions, UL 796F.

Notes

Claudia's Notes:
This revision of ANSI/UL 796 includes the removal of Requirements for Thin Core Substrates from Table 20.9.

This document comes with our free Notification Service, good for the life of the document.

This document is available in Paper format.