ASTM-D5109 › Historical Revision Information
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

ASTM-D5109 - 2012 EDITION - SUPERSEDED
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These test methods establish the standard procedures for testing copper-clad laminates produced from fiber-reinforced thermosetting polymeric materials intended for fabrication of printed wiring boards. The properties that these test methods shall examine are as follows: dielectric breakdown voltage parallel to laminations; dimensional instability; dissipation factor; flammability rating; flatwise flexural strength at room and elevated temperatures; behavior during oven blister test; peel strength at room and elevated temperatures; permittivity; pin holes and scratches in copper surface; purity of copper; behavior upong solder float test; solvent resistance; surface and volume resistivity; thickness; warp or twist; and water absorption.

ORDER

Scope

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

1.2 The procedures appear in the following sections:

Procedure

Section

 Referenced Documents

2

 Conditioning

4

 Dielectric Breakdown Voltage Parallel to Laminations

13

 Dimensional Instability

19

 Dissipation Factor

14

 Flammability Rating Test

16

 Flexural Strength, Flatwise at Elevated Temperature

15

 Flexural Strength, Flatwise at Room Temperature

15

 Oven Blister Test

17

 Peel Strength Test at Elevated Temperature

10

 Peel Strength Test at Room Temperature

9

 Permittivity

14

 Pin Holes in Copper Surface

20

 Purity of Copper

5

 Scratches in Copper Surface

21

 Solder Float Test

8

 Solvent Resistance

7

 Surface Resistivity

11

 Volume Resistivity

11

 Terminology

3

 Thickness & Thickness Variation

18

 Warp or Twist

6

 Water Absorption

12


1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.

Keywords

copper-clad laminate; dielectric breakdown parallel to laminations; dimensional instability; dissipation factor; fiber reinforced; flexural strength; industrial laminate; laminate; oven blister; peel strength; permittivity; printed circuit boards; printed wiring boards; rigid laminate; solder float; surface resistivity; thermoset; thickness variation; trace; twist; volume resistivity; warp; water absorption

To find similar documents by ASTM Volume:

10.02 (Electrical Insulation (II): D2518 - latest)

To find similar documents by classification:

31.180 (Printed circuits and boards)

83.140.20 (Laminated sheets)

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Document Number

ASTM-D5109-12

Revision Level

2012 EDITION

Status

Superseded

Modification Type

Withdrawn

Publication Date

Dec. 1, 2012

Document Type

Test Method

Page Count

9 pages

Committee Number

D09.07