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Scope

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1.1, 8.1.1, and 11.3.1.

1.3 Metric units are the preferred units for this standard. Inch pound units, where shown, are presented for information only.

1.4 The procedures appear in the following sections:

Procedure Section Referenced Documents 2 Conditioning 4 Dielectric Breakdown Voltage Parallel to Laminations 13 Dimensional Instability 19 Dissipation Factor 14 Flammability Rating Test 16 Flexural Strength, Flatwise at Elevated Temperature 15 Flexural Strength, Flatwise at Room Temperature 15 Oven Blister Test 17 Peel Strength Test at Elevated Temperature 10 Peel Strength Test at Room Temperature 9 Permittivity 14 Pin Holes in Copper Surface 20 Purity of Copper 5 Scratches in Copper Surface 21 Solder Float Test 8 Solvent Resistance 7 Surface Resistivity 11 Volume Resistivity 11 Terminology 3 Thickness ∧ Thickness Variation 18 Warp or Twist 6 Water Absorption 12

Keywords

Copper-clad materials Electrical properties Fiber reinforced polymers Industrial laminate Laminates-electrical insulation Polymers-electrical insulation applications Printed circuits Rigid laminate Thermosetting materials/properties Wiring boards copper-clad laminates-testing, from fiber-reinforced thermosetting polymers for printed wiring boards, Crosswise dimensional instability Dimensional instability Instability Lengthwise dimensional instability Stability-dimensional dimensional instability-copper-clad laminates, for printed wiring boards, test, Dielectric breakdown parallel to laminations Dielectric breakdown/strength-electrical insulating materials copper-clad laminates (moisture-conditioned)-dielectric breakdown voltage parallel to laminations, for printed wiring boards, test, Dielectric constant (permittivity)/dissipation factor-electrical insulating materials copper-clad laminates-dielectric constant (permittivity)/dissipation factor, for printed wiring boards, test, Flammability-electrical insulating materials copper-clad laminates-flammability rating, for printed wiring boards, test, Flexural strength-electrical insulating materials copper-clad laminates-flatwise flexural strength, for printed wiring boards, test, Oven blister test copper-clad laminates-elevated exposure ([∧lt;=]180°C), for printed wiring boards, test, Peel strength tests Peel strength tests-electrical conductors copper-clad laminates-peel strength, for printed wiring boards, test, Resistance and resistivity (electrical)-insulating materials Surface resistivity Volume resistivity copper-clad laminates-volume/surface resistivity, for printed wiring boards, test, SMOBC (soldermask over bare copper) Solder float test Solder/soldering applications copper-clad laminates-soldermask over bare copper (SMOBC), for printed wiring boards, test, Solvent resistance copper-clad laminates-solvent resistance, for printed wiring boards, test, Thickness-electrical insulating materials copper-clad laminates-thickness/dimensions/variation, for printed wiring boards, test, Water absorption-electrical insulating materials copper-clad laminates-water absorption, for printed wiring boards, test; ICS Number Code 31.180 (Printed circuits and boards); 83.140.20 (Laminated sheets)

To find similar documents by ASTM Volume:

10.02 (Electrical Insulation (II): D2518 - latest)

To find similar documents by classification:

31.180 (Printed circuits and boards)

83.140.20 (Laminated sheets)

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