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Scope

1.1 This test method covers a means for measuring the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.

1.2 This test method measures the potential heat output of an encapsulating compound under conditions that provide no significant heat sink.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 6.

Keywords

electronic; encapsulating compounds; exothermic temperature; microelectronic encapsulation; ICS Number Code 31.240 (Mechanical structures for electronic equipment)

To find similar documents by ASTM Volume:

10.02 (Electrical Insulation (II): D2518 - latest)

To find similar documents by classification:

31.240 (Mechanical structures for electronic equipment)

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