Document Center List of Standards on Mechanical Structures For Electronic Equipment
ICS Code 31.240
Return to ICS Index.Up to Level 1:
The following documents are a part of this series:
ASTM:
- ASTM-E2444 - Standard Terminology Relating to Measurements Taken on Thin, Reflecting Films
- ASTM-F18 - Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
- ASTM-F29 - Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications
- ASTM-F375 - Standard Specification for Integrated Circuit Lead Frame Material
- ASTM-F542 - Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)
BSI:
- BS-5549 - Specification for modular plug-in unit and standard 19-inch rack mounting unit based on NIM standard (for electronic nuclear instruments)
- BS-6103 - Specification for dimensions for the mounting of single-hole, bush-mounted spindle operated electronic components
- BS-EN-60286-2 - Packaging of components for automatic handling
- BS-EN-60286-2-TC - Tracked Changes. Packaging of components for automatic handling
- BS-EN-60286-3 - Packaging of components for automatic handling. Packaging of surface mount components on continuous tapes
- BS-EN-60286-3-1 - Packaging of components for automatic handling
- BS-EN-60286-3-2 - Packaging of components for automatic handling
- BS-EN-60286-4 - Packaging of components for automatic handling
- BS-EN-60297-3-100 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series
- BS-EN-60297-3-101 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series
- BS-EN-60297-3-102 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series
- BS-EN-60297-3-103 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series
- BS-EN-60297-3-104 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6mm(19 in) series
- BS-EN-60297-3-105 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series
- BS-EN-60297-3-106 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series
- BS-EN-60297-3-107 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series
- BS-EN-60297-3-108 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series
- BS-EN-60297-3-109 - Mechanical structures for electrical and electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series
- BS-EN-60297-5-100 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482.6 mm (19 in) series. Subracks and associated plug-in units
- BS-EN-60297-5-101 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482.6 mm (19 in) series. Subracks and associated plug-in units
- BS-EN-60297-5-102 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482.6 mm (19 in) series. Subracks and associated plug-in units
- BS-EN-60297-5-103 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482.6 mm (19 in) series. Subracks and associated plug-in units
- BS-EN-60297-5-104 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482.6 mm (19 in) series. Subracks and associated plug-in units
- BS-EN-60297-5-105 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482.6 mm (19 in) series. Subracks and associated plug-in units
- BS-EN-60297-5-107 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482.6 mm (19 in) series. Subracks and associated plug-in units
- BS-EN-60917-2-3 - Modular order for the development of mechanical structures for electronic equipment practices
- BS-EN-60917-2-4 - Modular order for the development of mechanical structures for electronic equipment practices
- BS-EN-60917-2-5 - Modular order for the development of mechanical structures for electronic equipment practices
- BS-EN-61076-3-122 - Connectors for electrical and electronic equipment. Product requirements
- BS-EN-61191-2 - Printed board assemblies
- BS-EN-61191-3 - Printed board assemblies
- BS-EN-61191-3-TC - Tracked Changes. Printed board assemblies
- BS-EN-61587-1 - Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297 series
- BS-EN-61587-2 - Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297
- BS-EN-61587-3 - Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297
- BS-EN-61587-4 - Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297 series
- BS-EN-61587-5 - Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297
- BS-EN-61587-6 - Mechanical structures for electrical and electronic equipment. Tests for IEC 60917 and IEC 60297 series
- BS-EN-61760-1 - Surface mounting technology
- BS-EN-61969-1 - Mechanical structures for electronic equipment. Outdoor enclosures
- BS-EN-61969-2 - Mechanical structures for electronic equipment. Outdoor enclosures
- BS-EN-61969-2-1 - Mechanical structures for electronic equipment. Outdoor enclosures. Detail specification
- BS-EN-61969-2-2 - Mechanical structures for electronic equipment. Outdoor enclosures. Detail specification
- BS-EN-61969-3 - Mechanical structures for electronic equipment. Outdoor enclosures
- BS-EN-62194 - Method of evaluating the thermal performance of enclosures
- BS-EN-62610-4 - Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series
- BS-EN-62610-5 - Mechanical structures for electrical and electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series
- BS-EN-62739-1 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy
- BS-EN-62739-2 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy
- BS-EN-62739-3 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy
- BS-EN-IEC-60286-3 - Packaging of components for automatic handling
- BS-EN-IEC-60297-3-110 - Mechanical structures for electrical and electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series
- BS-EN-IEC-61076-3-122 - Connectors for electrical and electronic equipment. Product requirements
- BS-EN-IEC-61076-3-122-TC - Tracked Changes. Connectors for electrical and electronic equipment. Product requirements
- BS-EN-IEC-61191-1 - Printed board assemblies
- BS-EN-IEC-61191-1-TC - Tracked Changes. Printed board assemblies
- BS-EN-IEC-61587-1 - Mechanical structures for electrical and electronic equipment. Tests for IEC 60917 and IEC 60297 series
- BS-EN-IEC-61587-1-TC - Tracked Changes. Mechanical structures for electrical and electronic equipment. Tests for IEC 60917 and IEC 60297 series
- BS-EN-IEC-61587-6-TC - Tracked Changes. Mechanical structures for electrical and electronic equipment. Tests for IEC 60917 and IEC 60297 series
- BS-EN-IEC-61760-1 - Surface mounting technology
- BS-EN-IEC-61760-2 - Surface mounting technology
- BS-EN-IEC-61760-2-TC - Tracked Changes. Surface mounting technology
- BS-EN-IEC-61969-1 - Mechanical structures for electrical and electronic equipment. Outdoor enclosures
- BS-EN-IEC-61969-1-TC - Tracked Changes. Mechanical structures for electrical and electronic equipment. Outdoor enclosures. Design guidelines.
- BS-EN-IEC-61969-3 - Mechanical structures for electrical and electronic equipment. Outdoor enclosures
- BS-EN-IEC-62610-2 - Mechanical structures for electrical and electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series
- BS-EN-IEC-62610-6 - Mechanical structures for electrical and electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series
- BS-EN-IEC-62966-1 - Mechanical structures for electrical and electronic equipment. Aisle containment for IT cabinets
- BS-EN-IEC-62966-2 - Mechanical structures for electrical and electronic equipment. Aisle containment for IT cabinets
- BS-IEC-60286-2 - Packaging of components for automatic handling. Packaging of components with unidirectional leads on continuous tapes
- BS-IEC-60286-4 - Packaging of components for automatic handling. Stick magazines for electronic components encapsulated in packages of different forms
- BS-IEC-60297-3-100 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Basic dimensions of front panels, subracks, chassis, racks and cabinets
- BS-IEC-60297-3-102 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Injector/extractor handle
- BS-IEC-60297-3-103 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Keying and alignment pin
- BS-IEC-60297-3-104 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6mm(19 in) series. Connector dependent interface dimensions of subracks and plug-in units
- BS-IEC-60297-3-105 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Dimensions and design aspects for 1U high chassis
- BS-IEC-60297-3-106 - Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1
- DD-IEC-62454 - Mechanical structures for electronic equipment. Design guide. Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
- DD-IEC-62610-1 - Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series
- DD-IEC-62610-2 - Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series. Design guide. Method for the determination of forced air-cooling structure
- DD-IEC-62610-3 - Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series
- PD-CLC-50484 - Recommendations for shielded enclosures
- PD-IEC-60286-7 - Packaging of components for automatic handling
- PD-IEC-60297-3-1 - Mechanical structures for electrical and electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series
- PD-IEC-62225 - Guidance on terms for connectors and mechanical structures in electronic equipment
- PD-IEC-62966-3 - Mechanical structures for electrical and electronic equipment. Aisle containment for it cabinets
IEC:
- IEC-60286-1 - Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
- IEC-60286-1-AM1 - Amendment 1 - Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
- IEC-60286-2 - Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes
- IEC-60286-2-1 - Amendment 1: Packaging of Components for Automatic Handling- Part 2: Tape Packaging of C
- IEC-60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
- IEC-60286-3-2 - Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI -lister carrier tapes of 4 mm width
- IEC-60286-3-3 - Packaging of components for automatic handling - Part 3-3: Packaging of surface mount components on continuous paper tapes for Auto Loading Feeder
- IEC-60286-3-4 - Packaging of components for automatic handling - Part 3-4: Packaging of surface mount components on continuous embossed tapes for Auto Loading Feeder
- IEC-60286-3-RL - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
- IEC-60286-4 - Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
- IEC-60286-7 - Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
- IEC-60297-3-1 - Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-1: Technological schemes and applications
- IEC-60297-3-100 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets
- IEC-60297-3-101 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units
- IEC-60297-3-102 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-102: Injector/extractor handle
- IEC-60297-3-103 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-103: Keying and alignment pin
- IEC-60297-3-104 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-104: Connector dependent interface dimensions of subracks and plug-in units
- IEC-60297-3-105 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U high chassis
- IEC-60297-3-106 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1
- IEC-60297-3-107 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor
- IEC-60297-3-108 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-108: Dimensions of R-type subracks and plug-in units
- IEC-60297-3-109 - Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices
- IEC-60297-3-110 - Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-110: Residential racks and cabinets for smart houses
- IEC-60297-4 - Part 4: Subracks & Associated Plug-in Units - Additional Dimensions, Mechanical Structures
- IEC-60297-5-100 - Part 5-100: Subracks & Associated Plug-in Units - Design Overview, Mechanical Structures F
- IEC-60297-5-101 - Part 5-101: Subracks & Associated Plug-in Units - Injector/Extractor Handle, Mechanical St
- IEC-60297-5-102 - Part 5-102: Subracks & Associated Plug-in Units - Electromagnetic Shielding Provision, Mec
- IEC-60297-5-103 - Part 5-103: Subracks & Associated Plug-in Units - Electrostatic Discharge Protection, Mech
- IEC-60297-5-104 - Part 5-104: Subracks & Associated Plug-in Units - Keying, Mechanical Structures for Electr
- IEC-60297-5-105 - Part 5-105: Subracks & Associated Plug-in Units - Alignment&/or Earth Pin, Mechanical St
- IEC-60297-5-107 - Part 5-107: Subracks & Associated Plug-in Units - Rear-Mounted Plug-in Units, Mechanical S
- IEC-60917-1 - Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard
- IEC-60917-1-1 - Amendment 1
- IEC-60917-2-3 - Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units
- IEC-60917-2-4 - Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in)
- IEC-60917-2-5 - Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment
- IEC-61191-1 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- IEC-61191-1-RL - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- IEC-61191-2 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
- IEC-61191-3 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
- IEC-61191-4 - Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
- IEC-61587-1 - Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test setups and safety aspects
- IEC-61587-2 - Mechanical structures for electronic equipment - Tests for IEC 60917 and 60297 - Part 2: Seismic tests for cabinets and racks
- IEC-61587-3 - Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks
- IEC-61587-4 - Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 4: Combination of performance levels for modular cabinets
- IEC-61587-5 - Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks and plug-in units
- IEC-61587-6 - Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 6: Security aspects for indoor cabinets
- IEC-61760-1 - Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
- IEC-61760-2 - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- IEC-61760-2-RL - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- IEC-61969-1 - Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 1: Design guidelines
- IEC-61969-1-RL - Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 1: Design guidelines
- IEC-61969-2 - Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Coordination dimensions
- IEC-61969-2-1 - Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects
- IEC-61969-2-2 - Part 2-2: Detail Specification - Dimensions for Cases, Mechanical Structures for Electroni
- IEC-61969-3 - Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects
- IEC-61969-3-RL - Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects
- IEC-62194 - Method of evaluating the thermal performance of enclosures
- IEC-62454 - Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
- IEC-62610-1 - Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
- IEC-62610-2 - Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Design guide: Method for determination of forced air-cooling structure
- IEC-62610-3 - Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect)
- IEC-62610-4 - Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets
- IEC-62610-5 - Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor cabinets
- IEC-62610-6 - Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 Series - Part 6: Air recirculation and bypass of indoor cabinets
- IEC-62739-1 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
- IEC-62739-2 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
- IEC-62739-3 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
- IEC-62966-1 - Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 1: Dimensions and mechanical requirements
- IEC-62966-2 - Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 2: Details of air flow, air separation and air cooling requirements
- IEC-62966-3 - Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 3: Aspects of operational and personal safety
- IEC-63098-4 - Transmitting and receiving equipment for radiocommunication - Radio-over-fibre technologies and their performance standard - Part 4: Radio-over-fibre-based indoor distributed antenna system (DAS) for 5G
- IEC-917-2 - Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice
- IEC-917-2-1 - Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 1: Detail specification - Dimensions for cabinets and racks
- IEC-917-2-2 - Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units
Other SDOs:
- EN-60286-1 - Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
- EN-60286-2 - Packaging of components for automatic handling - Part 2: Packaging of components with unidirectional leads on continuous tapes
- EN-60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
- EN-60286-3-1 - Part 3-1: Packaging of Surface Mount Components on Continuos Tapes - Type V - Pressed
- EN-60286-3-2 - Part 3-2: Packaging of Surface Mount Components on Continuous Tapes - Type VI - Bliste
- EN-60286-4 - Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
- EN-60297-3-100 - Mechanical Structures for Electronic Equipment, Dimensions of Mechanical Structures Of
- EN-60297-3-101 - Mechanical Structures for Electronic Equipment, Dimensions of Mechanical Structures Of
- EN-60297-3-104 - Mechanical Structures for Electronic Equipment, Dimensions of Mechanical Structures Of
- EN-60297-3-105 - Mechanical Structures for Electronic Equipment, Dimensions of Mechanical Structures Of
- EN-60297-3-106 - Part 3-106: Adaptation Dimensions for Subracks & Chassis Applicable With Metric Cabine
- EN-60297-3-107 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor
- EN-60297-3-108 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-108: Dimensions of R-type subracks and plug-in units
- EN-60297-3-109 - Mechanical structures for electrical and electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Dimensions of chassis for embedded computing devices
- EN-60917-2-4 - Part 2-4: Sectional Specification - Interface Coordination Dimensions for the 25 mm Eq
- EN-60917-2-5 - Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment
- EN-61191-1 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- EN-61191-2 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
- EN-61191-3 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
- EN-61191-4 - Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
- EN-61587-1 - Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation
- EN-61587-2 - Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 2: Seismic tests for cabinets and racks
- EN-61587-3 - Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks
- EN-61587-4 - Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 4: Combination of performance levels for modular cabinets
- EN-61587-5 - Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks and plug-in units
- EN-61587-6 - Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 6: Security aspects for indoor cabinets
- EN-61760-1 - Surface Mounting Technology, Standard Method for the Specification of Surface Mounting
- EN-61969-1 - Mechanical structures for electronic equipment - Outdoor enclosures - Part 1: Design guidelines
- EN-61969-2 - Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Coordination dimensions
- EN-61969-2-1 - Mechanical Structures for Electronic Equipment, Outdoor Enclosures, Detail Specificati
- EN-61969-2-2 - Mechanical Structures for Electronic Equipment, Outdoor Enclosures, Detail Specificati
- EN-61969-3 - Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects
- EN-62610-4 - Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets
- EN-62610-5 - Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor cabinets
- EN-62739-1 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
- EN-62739-2 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
- EN-62739-3 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
- EN-IEC-60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019)
- EN-IEC-62610-2 - Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Method for the determination of forced air cooling
- EN-IEC-62966-1 - Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 1: Dimensions and mechanical requirements (IEC 62966-1:2019)