ASTM-F542 › Historical Revision Information
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
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Scope
1.1 This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.
1.2 This test method provides a means to measure the peak exothermic temperature of an encapsulating compound.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8.
Note 1—There is no equivalent IEC standard.
Keywords
electronic; encapsulating compounds; exothermic temperature; microelectronic encapsulation; ICS Number Code 31.240 (Mechanical structures for electronic equipment)
To find similar documents by ASTM Volume:
10.02 (Electrical Insulation (II): D2518 - latest)
To find similar documents by classification:
31.240 (Mechanical structures for electronic equipment)
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Document Number
ASTM-F542-02
Revision Level
2002 EDITION
Status
Superseded
Modification Type
Revision
Publication Date
Sept. 10, 2002
Document Type
Test Method
Page Count
3 pages
Committee Number
D09.01