ASTM-F636 › Historical Revision Information
Selection of Tests for Material Properties Oftransfer Molding Compounds for Electronic & M
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Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)
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10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)
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Document Number
ASTM-F636-85(1991)
Revision Level
1985 EDITION
Status
Cancelled
Modification Type
Withdrawn
Publication Date
May 30, 1985
Document Type
Guide
Page Count
5 pages