BS-4584-11 Specification for metal-clad base materials for printed circuits. Bonding sheet material for use in the fabrication of multilayer printed boards: EP-GC-11

BS-4584-11 - 1977 EDITION - SUPERSEDED -- See the following: BS-4584-103.1
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Specification for metal-clad base materials for printed circuits. Bonding sheet material for use in the fabrication of multilayer printed boards: EP-GC-11


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31.180 (Printed circuits and boards)

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Document Number

BS 4584-11:1977

Revision Level

1977 EDITION

Status

Superseded

Publication Date

Dec. 30, 1977

Page Count

16 pages