BS-EN-60749-37 › Semiconductor devices. Mechanical and climatic test methods

BS-EN-60749-37 - 2008 EDITION - SUPERSEDED
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Semiconductor devices. Mechanical and climatic test methods

Keywords

Printed-circuit boards;Electronic equipment and components;Integrated circuits;Surface mounting devices;Accelerated testing;Environmental testing;Drop tests;Semiconductor devices;Mechanical testing;Impact testing

To find similar documents by classification:

31.080.01 (Semiconductor devices in general)

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Document Number

BS EN 60749-37:2008

Revision Level

2008 EDITION

Status

Superseded

Publication Date

May 30, 2008

Replaces

DD IEC/PAS 62050:2004

Replaced By

BS EN IEC 60749-37:2022

Page Count

22

ISBN

9780580555091

International Equivalent

IEC 60749-37:2008;EN 60749-37:2008

Committee Number

EPL/47