BS-EN-61760-4 › Historical Revision Information
Surface mounting technology. Classification, packaging, labelling and handling of moisture sensitive devices

BS-EN-61760-4 - 2015 EDITION - SUPERSEDED
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Surface mounting technology

Keywords

Holes, Integrated circuit technology, Solderability testing, Packaging, Microassembling, Surface mounting devices, Electronic equipment and components, Integrated circuits, Soldering, Marking, Electrical components, Cleaning

To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS EN 61760-4:2015

Revision Level

2015 EDITION

Status

Superseded

Publication Date

July 31, 2015

Page Count

36

ISBN

9780580786877

International Equivalent

EN 61760-4 (IEC 61760-4:2015) IEC 61760-4:2015

Committee Number

EPL/501