BS-EN-62137-3 › Electronics assembly technology
BS-EN-62137-3
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2012 EDITION
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CURRENT
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Electronics assembly technology
Keywords
Solders;Electronic equipment and components;Mechanical testing;Environmental testing;Surface mounting devices;Soldering;Life (durability);Integrated circuits;Soldered joints;Thermal testing;Printed-circuit boards;Endurance testing
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
BS EN 62137-3:2012
Revision Level
2012 EDITION
Status
Current
Publication Date
March 31, 2012
Replaces
DD IEC/PAS 62137-3:2008
Page Count
47
ISBN
9780580683701
International Equivalent
EN 62137-3:2012;IEC 61310-3:2007;EN 61310-3:2008;IEC 62137-3:2011
Committee Number
EPL/501