BS-EN-62137-3 Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

BS-EN-62137-3 - 2012 EDITION - CURRENT


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Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

Keywords

Solders, Electronic equipment and components, Mechanical testing, Environmental testing, Surface mounting devices, Soldering, Life (durability), Integrated circuits, Soldered joints, Thermal testing, Printed-circuit boards, Endurance testing

To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS EN 62137-3:2012

Revision Level

2012 EDITION

Status

Current

Publication Date

March 31, 2012

Page Count

45

ISBN

9780580683701

International Equivalent

EN 61310-3 (IEC 61310-3:2007) EN 62137-3 (IEC 62137-3:2011) IEC 61310-3:2007 IEC 62137-3:2011

Committee Number

EPL/501