BS-EN-62137 › Historical Revision Information
Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

BS-EN-62137 - 2004 EDITION - SUPERSEDED -- See the following: BS-EN-62137-4
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Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Keywords

Reliability;Soldering;Thermal stress;Printed circuits;Integrated circuits;Life (durability);Electronic equipment and components;Printed-circuit boards;Mechanical testing;Quality control;Environmental testing;Performance testing;Soldered joints;Surface mounting devices;Semiconductor devices;Endurance testing

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31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS EN 62137:2004

Revision Level

2004 EDITION

Status

Superseded

Publication Date

May 13, 2005

Replaces

DD IEC/PAS 62137-3:2008

Replaced By

BS EN 62137-4:2014

Page Count

30

ISBN

0580445054

International Equivalent

EN 60464-2:2001;IEC 62137:2004/COR1:2005

Committee Number

EPL/501