BS-EN-62137 › Historical Revision Information
Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
BS-EN-62137
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REPLACED BY BS-EN-62137-4
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SUPERSEDED
-- See the following:
BS-EN-62137-4
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Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Keywords
Reliability;Soldering;Thermal stress;Printed circuits;Integrated circuits;Life (durability);Electronic equipment and components;Printed-circuit boards;Mechanical testing;Quality control;Environmental testing;Performance testing;Soldered joints;Surface mounting devices;Semiconductor devices;Endurance testing
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
Document Number
BS-EN-62137
Revision Level
REPLACED BY BS-EN-62137-4
Status
Superseded
Publication Date
Feb. 28, 2015
International Equivalent
EN 60464-2:2001;IEC 62137:2004/COR1:2005
Committee Number
EPL/501