BS-EN-IEC-61760-3 › Surface mounting technology
BS-EN-IEC-61760-3
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2021 EDITION
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CURRENT
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Surface mounting technology
Keywords
Marking;Packaging;Surface mounting devices;Soldering;Electronic equipment and components;Cleaning;Integrated circuit technology;Solderability testing;Microassembling;Electrical components;Holes;Integrated circuits
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
BS EN IEC 61760-3:2021
Revision Level
2021 EDITION
Status
Current
Publication Date
March 18, 2021
Replaces
BS EN 61760-3:2010
Page Count
34
ISBN
9780539045857
International Equivalent
EN 61760-3 Ed.2.0;IEC 61760-3 Ed.2.0
Committee Number
EPL/501