EN-61190-1-2 › Complete Document History
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
| Complete Current Edition: |
|
2014 EDITION - ONLY AVAILABLE IN NATIONAL EDITIONS - May 23, 2014
|
Obsolete Revision Information: |
|
2007 EDITION - ONLY AVAILABLE IN NATIONAL EDITIONS - Jan. 1, 2007
2002 EDITION - ONLY AVAILABLE IN NATIONAL EDITIONS - June 1, 2002 |