EN-61190-1-2 › Historical Revision Information
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN-61190-1-2
-
2007 EDITION
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SUPERSEDED
-- See the following:
BS-EN-61190-1-2
DIN-EN-61190-1-2
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
Document Number
EN-61190-1-2
Revision Level
2007 EDITION
Status
Superseded
Publication Date
Jan. 1, 2007