IEC-60749-16 › Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

IEC-60749-16 - 1ST EDITION - CURRENT


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Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
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Document Number

IEC 60749-16 Ed. 1.0 b:2003

Revision Level

1ST EDITION

Status

Current

Publication Date

Jan. 1, 2003

Committee Number

47