IEC-60749-19 › Complete Document History
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
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EDITION 1.1 - CONSOLIDATED AMENDMENT 1 - Nov. 1, 2010
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Obsolete Revision Information: |
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FOR AMENDMENT 1 - IEC-60749-19-AM1 - July 1, 2010
1ST EDITION - PART 19: DIE SHEAR STRENGTH, S - Feb. 1, 2003 |