IEC-60749-19 › Historical Revision Information
Part 19: Die Shear Strength, Semiconductor Devices - Mechanical & Climatic Test Methods
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Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.
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31.080.01 (Semiconductor devices in general)
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Document Number
IEC-60749-19
Revision Level
FOR AMENDMENT 1
Status
Superseded
Publication Date
July 1, 2010
Committee Number
47